On October 9, the Hong Kong branch of the Central News Agency reported that the Ministry of Finance will issue the fifth batch of RMB government bonds for 2024 in the Hong Kong Special Administrative Region on October 16, with a total issuance scale of 8 billion yuan (RMB). The detailed issuance arrangements will be announced through the Central Moneys Unit (CMU) of the Hong Kong Monetary Authority (HKMA).
On the same day, the HKMA released a tender announcement, stating that it would offer an additional 3 billion yuan of 2026 bonds, 3 billion yuan of 2027 bonds, and 2 billion yuan of 2029 bonds to qualified members of the CMU. These bonds will be available for competitive bidding through the central settlement system’s bond tender platform.
Following the issuance, the additional 2026 bonds will be consolidated into a single series with the existing 2026 bonds, creating the “2026 Government Bonds.” Likewise, the additional 2027 bonds will merge with the existing 2027 bonds to form the “2027 Government Bonds,” and the additional 2029 bonds will combine with the existing 2029 bonds to establish the “2029 Government Bonds.” Collectively, the 2026, 2027, and 2029 bonds will be referred to as “Government Bonds.”
The annual interest rates for the 2026, 2027, and 2029 bonds are set at 2.20%, 2.28%, and 2.39%, respectively, with maturity aligned to the last interest payout dates in 2026, 2027, and 2029.
Each bid must be submitted in increments of 500,000 yuan, and the price fluctuation for the additional bonds will be capped at 0.01%, retaining two decimal places after the point.
